APA (7th ed.) Citation

Amistoso, J. O. S. Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps.

Chicago Style (17th ed.) Citation

Amistoso, Jose Omar S. Phenomenological Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer Level Solder Bumps. 2007.

MLA (9th ed.) Citation

Amistoso, Jose Omar S. Phenomenological Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer Level Solder Bumps.