Understanding the effect of surface flaws on fracture of silicon die
An integrated circuit (IC) silicon die experiences different thermomechanical stresses during assembly, test, mounting and application. Ideally, the silicon dice is expected to withstand stresses induced during normal processing and application. But it is not uncommon for standard assembled package...
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 语言: | English |