Materials selection of polysaccharide-based bioplastics for rigid semiconductor packaging applications

Materials selection of polysaccharide-based bioplastics for rigid semiconductor packaging applications

Bibliographic Details
Main Author: Cuenca, Faith R. (Author)
Other Authors: Lao, Tiffany Louise B. (adviser.)
Format: Thesis
Language:English
Published: Quezon City College of Engineering, University of the Philippines Diliman 2025.
Subjects:
Semiconductor industry.
Polysaccharide-based bioplastics.
Semiconductor packaging.
Online Access:Abstract