<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.loc.gov/MARC21/slim http://www.loc.gov/standards/marcxml/schema/MARC21slim.xsd" xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>00000nam a22000007i 4500</leader>
  <controlfield tag="001">UP-8027295163992786304</controlfield>
  <controlfield tag="003">Buklod</controlfield>
  <controlfield tag="005">20240809150314.0</controlfield>
  <controlfield tag="006">m    |o  d |      </controlfield>
  <controlfield tag="007">cr |||||||||||</controlfield>
  <controlfield tag="008">240809s2021    sz         u        eng  </controlfield>
  <datafield tag="020" ind1=" " ind2=" ">
   <subfield code="a">9783030703325 (eBook)</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
   <subfield code="a">(Buklod)UP-99946688289970973</subfield>
  </datafield>
  <datafield tag="040" ind1=" " ind2=" ">
   <subfield code="d">DENGII</subfield>
   <subfield code="e">rda</subfield>
   <subfield code="a">DLC</subfield>
  </datafield>
  <datafield tag="041" ind1=" " ind2=" ">
   <subfield code="a">eng</subfield>
  </datafield>
  <datafield tag="084" ind1=" " ind2=" ">
   <subfield code="a">TA 401.3 </subfield>
   <subfield code="b">E54 2021eb</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="0">
   <subfield code="a">Enhanced material, parts optimization and process intensification</subfield>
   <subfield code="b">proceedings of the first International Joint Conference on Enhanced Material and Part Optimization and Process Intensification, Emporia 2020, May 19-20, 2020, Aachen, Germany</subfield>
   <subfield code="c">Uwe Reisgen, Dietmar Drummer, Holger Marschall, editors.</subfield>
  </datafield>
  <datafield tag="264" ind1=" " ind2="1">
   <subfield code="a">Cham, Switzerland</subfield>
   <subfield code="b">Springer</subfield>
   <subfield code="c">[2021]</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
   <subfield code="a">1 online resource.</subfield>
  </datafield>
  <datafield tag="336" ind1=" " ind2=" ">
   <subfield code="a">text</subfield>
   <subfield code="b">txt</subfield>
   <subfield code="2">rdacontent</subfield>
  </datafield>
  <datafield tag="337" ind1=" " ind2=" ">
   <subfield code="a">computer</subfield>
   <subfield code="2">rdamedia</subfield>
  </datafield>
  <datafield tag="338" ind1=" " ind2=" ">
   <subfield code="a">online resource</subfield>
   <subfield code="b">nc</subfield>
   <subfield code="2">rdacarrier</subfield>
  </datafield>
  <datafield tag="506" ind1=" " ind2=" ">
   <subfield code="a">IP based subscription, on campus and remote access</subfield>
   <subfield code="c">Access via Electronic Resources of the UPD Engineering Library and University Library websites.</subfield>
  </datafield>
  <datafield tag="520" ind1="0" ind2=" ">
   <subfield code="a">This book reports on topics at the interface between material processing, product and process optimization. It covers new developments and challenges in welding, brazing, cutting and coating, casting and molding, additive manufacturing, simulation and optimization techniques, as well as functional and structural materials and composites. Gathering authoritative contributions on the latest research and applications, presented at the International Joint Conference on Enhanced Material and Part Optimization and Process Intensification, EMPOrIA 2020, organized by SFB1120 Aachen, SFB814 Erlangen and CCE Darmstadt, on May 19–20, 2020, in Aachen, this book provides academics, students, and professionals with a timely snapshot of the main research trends, and extensive information on cutting-edge methods and technologies in materials, manufacturing and process engineering.</subfield>
  </datafield>
  <datafield tag="533" ind1=" " ind2=" ">
   <subfield code="a">Electronic reproduction</subfield>
   <subfield code="b">Cham, Switzerland</subfield>
   <subfield code="c">Springer</subfield>
   <subfield code="d">2021</subfield>
   <subfield code="n">Available via World Wide Web through SpringerLink.</subfield>
  </datafield>
  <datafield tag="650" ind1="0" ind2="0">
   <subfield code="a">Materials </subfield>
   <subfield code="v">Congresses.</subfield>
  </datafield>
  <datafield tag="650" ind1="0" ind2="0">
   <subfield code="a">Manufacturing processes </subfield>
   <subfield code="v">Congresses.</subfield>
  </datafield>
  <datafield tag="650" ind1="0" ind2="0">
   <subfield code="a">Production engineering </subfield>
   <subfield code="v">Congresses.</subfield>
  </datafield>
  <datafield tag="650" ind1="0" ind2="0">
   <subfield code="a">Electronic books.</subfield>
  </datafield>
  <datafield tag="700" ind1="0" ind2=" ">
   <subfield code="a">Drummer, Dietmar</subfield>
   <subfield code="e">editor.</subfield>
  </datafield>
  <datafield tag="700" ind1="0" ind2=" ">
   <subfield code="a">Marschall, Holger</subfield>
   <subfield code="e">editor.</subfield>
  </datafield>
  <datafield tag="700" ind1="1" ind2=" ">
   <subfield code="a">Reisgen, Uwe</subfield>
   <subfield code="d">1962-</subfield>
   <subfield code="e">editor.</subfield>
  </datafield>
  <datafield tag="856" ind1=" " ind2=" ">
   <subfield code="z">Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy</subfield>
   <subfield code="u">https://link-springer-com.ezproxy.engglib.upd.edu.ph/book/10.1007/978-3-030-70332-5</subfield>
  </datafield>
  <datafield tag="856" ind1=" " ind2=" ">
   <subfield code="z">Available for University of the Philippines System via SpringerLink.  Click here to access</subfield>
   <subfield code="u">https://doi.org/10.1007/978-3-030-70332-5</subfield>
  </datafield>
  <datafield tag="905" ind1=" " ind2=" ">
   <subfield code="a">FO</subfield>
  </datafield>
  <datafield tag="852" ind1="0" ind2=" ">
   <subfield code="a">UPD</subfield>
   <subfield code="b">DENG-II</subfield>
   <subfield code="h">TA 401.3</subfield>
   <subfield code="i">E54 2021eb</subfield>
  </datafield>
  <datafield tag="942" ind1=" " ind2=" ">
   <subfield code="a">Electronic Resource</subfield>
  </datafield>
 </record>
</collection>
