00000nam a2200000 i 4500 UP-1685675941122049459 Buklod 20231206160040.0 m |o d | cr ||||||||||| 230802s2019 nyu go j eng| 9780791861936 (eBook) (Buklod)UP-1685675941122047309 DLC DENGII rda eng TK 7870.25 Y44 2019eb Yeh, L.T. author. Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices L.T. Yeh. New York, N.Y. The American Society of Mechanical Engineers [2019] 1 online resource. text txt rdacontent computer rdamedia online resource cr rdacarrier Includes index. IP based subscription, on campus and remote access Access via Electronic Resources of the UPD Engineering Library and University Library websites. Electronic apparatus and appliances Cooling. Electronic books. Electronic apparatus and appliances Thermal properties. Microelectronics Equipment and supplies. Cold plates (Electronics). Also available remotely for University of the Philippines System via ASME Digital Collection. Click here to access thru EZproxy https://doi-org.ezproxy.engglib.upd.edu.ph/10.1115/1.861936 Available for University of the Philippines System via ASME Digital Collection. Click here to access https://doi.org/10.1115/1.861936 (viewed August 2, 2023) FO UPD DENG-II TK 7870.25 Y44 2019EB Electronic Resource