Nickel electrodeposition using deep eutetectic solvent-based electrolyte
While nickel (Ni) electroplating has been successfully performed using ionic liquids in the past, few have reported on the trench-filling characteristics of this process useful for electroforming Ni. This study aimed to deposit and characterize the electrodeposited nickel using an enthaline-based ૦-...
| Julkaisussa: | Philippine Journal of Science Vol. 152, no. 2 (Apr. 2023), 591-602 |
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| Päätekijä: | |
| Aineistotyyppi: | Artikkeli |
| Kieli: | English |
| Julkaistu: |
2023
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| Aiheet: |