APA (7th ed.) Citation

Clemente, R. Q., & Basilia, B. A. (2009). Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages. Philippine Engineering Journal.

Chicago Style (17th ed.) Citation

Clemente, Richard Q., and Blessie A. Basilia. "Board-level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube-filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal 2009.

MLA (9th ed.) Citation

Clemente, Richard Q., and Blessie A. Basilia. "Board-level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube-filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal, 2009.