TY  - JOUR
T1  - Investigation of silicon die crack for varying silicon die parameters and die attach material
JF  - Philippine Engineering Journal
A1  - Macaspac, Hannah Erika
A2  - Callanga, Jennifer F.
A2  - Dimagiba, Richard Raymond
A2  - Mena, Manolo
LA  - English
YR  - 2020
UL  - https://tuklas.up.edu.ph/Record/IPP-00000635581
KW  - Transistor design & construction
KW  - Microelectronics
KW  - Semiconductors
ER  -