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Effect of percentage alumina on the growth kinetics of copper and hardness of Cu-Al2O3 composite by Velasco, Angelito A.
Published in Philippine Engineering Journal (2004)Call Number: loading...
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Parametric and kinetic study of silicon nitride film deposition on silicon wafer by low pressure chemical vapor deposition (LPCVD) method by Velasco, Angelito A.
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3
Parametric and kinetic study of silicon nitride film deposition on silicon wafer by Low Pressure Chemical Vapor Deposition (LPCVD) method by Velasco, Angelito A.
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Parametric and kinetic study of silicon nitride film deposition on silicon wafer by low pressure chemical vapor deposition (LPCVD) Method by Velasco, Angelito A.
Published in Philippine Engineering JournalCall Number: loading...Also available online for University of the Philippines Diliman. Click here
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5
Parametric and Kinetic Study of Silicon Nitride Film Deposition on Silicon Wafer by Low Pressure Chemical Vapor Deposition (LPCVD) Method. by Velasco, Angelito A.
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6
Effect of percentage alumina on the growth kinetics of copper and hardness of Cu-Al2O3 composite by Velasco, Angelito A.
Published in Philippine Engineering JournalCall Number: loading...Also available online for University of the Philippines Diliman. Click here
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