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Fundamentals of device and systems packaging technologies and applications
Julkaistu 2019Hyllypaikka: loading...Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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2
System-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-
Julkaistu 2008Hyllypaikka: loading...Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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3
Introduction to system-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-
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4
Fundamentals of microsystems packaging
Julkaistu 2001Hyllypaikka: loading...Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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5
Microelectronics packaging handbook
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