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  1. 1

    Advanced materials for thermal management of electronic packaging por Tong, Xingcun Colin

    Publicado em 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  2. 2

    Advanced materials and design for electromagnetic interference shielding por Tong, Xingcun Colin

    Publicado em 2009
    Table of contents only
    Livro

    Advanced materials and design for electromagnetic interference shielding

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