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  1. 1

    Advanced materials for thermal management of electronic packaging od Tong, Xingcun Colin

    Wydane 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  2. 2

    Advanced materials and design for electromagnetic interference shielding od Tong, Xingcun Colin

    Wydane 2009
    Table of contents only
    Książka

    Advanced materials and design for electromagnetic interference shielding

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