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Advanced materials for thermal management of electronic packaging 著者: Tong, Xingcun Colin
出版事項 2011請求記号: loading...Available for University of the Philippines Diliman via SpringerLink. Click here to access
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Electronic Resource -
2
Advanced materials and design for electromagnetic interference shielding 著者: Tong, Xingcun Colin
出版事項 2009請求記号: loading...Table of contents only
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図書


