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  1. 1

    Advanced materials for thermal management of electronic packaging von Tong, Xingcun Colin

    Veröffentlicht 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  2. 2

    Advanced materials and design for electromagnetic interference shielding von Tong, Xingcun Colin

    Veröffentlicht 2009
    Table of contents only
    Buch

    Advanced materials and design for electromagnetic interference shielding

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