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Managing more-than-moore integration technology development a story of an advanced technology program in the semiconductor industry por Radojcic, Riko
Publicado em 2019Número de Chamada: loading...Available for University of the Philippines Diliman via SpringerLink. Click here to access
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More-than-Moore 2.5D and 3D SiP integration por Radojcic, Riko
Publicado em 2017Número de Chamada: loading...Available for University of the Philippines System via SpringerLink. Click here to access
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Three dimensional system integration IC stacking process and design
Publicado em 2010Número de Chamada: loading...Available for the University of the Philippines Diliman via SpringerLink. Click here to access
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