Managing more-than-moore integration technology development a story of an advanced technology program in the semiconductor industry per Radojcic, Riko

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More-than-Moore 2.5D and 3D SiP integration per Radojcic, Riko

Available for University of the Philippines System via SpringerLink. Click here to access
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Three dimensional system integration IC stacking process and design

Available for the University of the Philippines Diliman via SpringerLink. Click here to access