Search Results - Macaspac, Hannah Erika

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  1. 1

    Investigation of silicon die crack for varying silicon die parameters and die attach material by Macaspac, Hannah Erika

    Published in Philippine Engineering Journal (2020)
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  2. 2

    Analysis of crack propagation under different die tilt configuration on a small outline transistor by Callanga, Jennifer, Macaspac, Hannah Erika, Danao, Louis Angelo, Mena, Manolo

    Available for University of the Philippines Diliman. Click here
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  3. 3

    Investigation of silicon die crack for varying silicon die parameters and die attach materials by Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

    Available for University of the Philippines Diliman. Click here
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  4. 4

    Analysis of crack propagation under different die tilt configuration on a small outline transistor by Callanga, Jennifer F.

    Published in Philippine Engineering Journal (2020)
    Article


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