Ngā hua rapu - Macaspac, Hannah Erika

Investigation of silicon die crack for varying silicon die parameters and die attach material mā Macaspac, Hannah Erika

Analysis of crack propagation under different die tilt configuration on a small outline transistor mā Callanga, Jennifer, Macaspac, Hannah Erika, Danao, Louis Angelo, Mena, Manolo

Available for University of the Philippines Diliman. Click here

Investigation of silicon die crack for varying silicon die parameters and die attach materials mā Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

Available for University of the Philippines Diliman. Click here

Analysis of crack propagation under different die tilt configuration on a small outline transistor mā Callanga, Jennifer F.