Resultados de procura - Macaspac, Hannah Erika

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  1. 1

    Investigation of silicon die crack for varying silicon die parameters and die attach material por Macaspac, Hannah Erika

    Publicado en Philippine Engineering Journal (2020)
    Artigo


    Imaxe de Portada
  2. 2

    Analysis of crack propagation under different die tilt configuration on a small outline transistor por Callanga, Jennifer, Macaspac, Hannah Erika, Danao, Louis Angelo, Mena, Manolo

    Available for University of the Philippines Diliman. Click here
    Artigo


    Imaxe de Portada
  3. 3

    Investigation of silicon die crack for varying silicon die parameters and die attach materials por Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

    Available for University of the Philippines Diliman. Click here
    Artigo


    Imaxe de Portada
  4. 4

    Analysis of crack propagation under different die tilt configuration on a small outline transistor por Callanga, Jennifer F.

    Publicado en Philippine Engineering Journal (2020)
    Artigo


    Imaxe de Portada

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