Suchergebnisse - Lau, John H.
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Microvias for low-cost, high density interconnects
Veröffentlicht 2001Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource
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Reliability of RoHS-Compliant 2D and 3D IC interconnects
Veröffentlicht 2011Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Chip scale package (CSP) design, materials, processes, reliability, and applications
Veröffentlicht 1999Buch -
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3D IC integration and packaging
Veröffentlicht 2016Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Through-silicon vias for 3D integration
Veröffentlicht 2013Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Assembly and reliability of lead-free solder joints
Veröffentlicht 2020Available for University of the Philippines Diliman via SpringerLink. Click here to access
Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
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