Canlyniadau Chwilio - Lau, John H.

Mireinio'r Canlyniadau
  1. 1

    Semiconductor advanced packaging gan Lau, John H.

    Cyhoeddwyd 2021
    Cael y testun llawn
    Cael y testun llawn
    Electronic Resource


    Delwedd Flaen
  2. 2

    Microvias for low-cost, high density interconnects gan Lau, John H.

    Cyhoeddwyd 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  3. 3

    Reliability of RoHS-Compliant 2D and 3D IC interconnects gan Lau, John H.

    Cyhoeddwyd 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  4. 4

    Chip scale package (CSP) design, materials, processes, reliability, and applications gan Lau, John H.

    Cyhoeddwyd 1999
    Llyfr


    Delwedd Flaen
  5. 5

    Fan-out wafer-level packaging gan Lau, John H.

    Cyhoeddwyd 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  6. 6

    Heterogeneous integrations gan Lau, John H.

    Cyhoeddwyd 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  7. 7

    3D IC integration and packaging gan Lau, John H.

    Cyhoeddwyd 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  8. 8

    Through-silicon vias for 3D integration gan Lau, John H.

    Cyhoeddwyd 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  9. 9

    Assembly and reliability of lead-free solder joints gan Lau, John H., Lee, Ning-Cheng

    Cyhoeddwyd 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


    Delwedd Flaen
  10. 10

    Ball grid array technology

    Cyhoeddwyd 1995
    Llyfr


    Delwedd Flaen

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