Zoekresultaten - Lau, John H.

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  1. 1

    Semiconductor advanced packaging door Lau, John H.

    Gepubliceerd in 2021
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    Electronic Resource


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  2. 2

    Microvias for low-cost, high density interconnects door Lau, John H.

    Gepubliceerd in 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


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  3. 3

    Reliability of RoHS-Compliant 2D and 3D IC interconnects door Lau, John H.

    Gepubliceerd in 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


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  4. 4

    Chip scale package (CSP) design, materials, processes, reliability, and applications door Lau, John H.

    Gepubliceerd in 1999
    Boek


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  5. 5

    Fan-out wafer-level packaging door Lau, John H.

    Gepubliceerd in 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


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  6. 6

    Heterogeneous integrations door Lau, John H.

    Gepubliceerd in 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


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  7. 7

    3D IC integration and packaging door Lau, John H.

    Gepubliceerd in 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


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  8. 8

    Through-silicon vias for 3D integration door Lau, John H.

    Gepubliceerd in 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource


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  9. 9

    Assembly and reliability of lead-free solder joints door Lau, John H., Lee, Ning-Cheng

    Gepubliceerd in 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource


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  10. 10

    Ball grid array technology

    Gepubliceerd in 1995
    Boek


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