Dangos 1 - 10 canlyniadau o 17 ar gyfer chwilio 'Lau, John H.', amser ymholiad: 0.01e Mireinio'r Canlyniadau
  1. 1

    Semiconductor advanced packaging gan Lau, John H.

    Cyhoeddwyd 2021
    Cael y testun llawn
    Cael y testun llawn
    Electronic Resource

    Semiconductor advanced packaging
  2. 2

    Assembly and reliability of lead-free solder joints gan Lau, John H., Lee, Ning-Cheng

    Cyhoeddwyd 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  3. 3

    Heterogeneous integrations gan Lau, John H.

    Cyhoeddwyd 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  4. 4

    Fan-out wafer-level packaging gan Lau, John H.

    Cyhoeddwyd 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  5. 5

    3D IC integration and packaging gan Lau, John H.

    Cyhoeddwyd 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  6. 6

    Through-silicon vias for 3D integration gan Lau, John H.

    Cyhoeddwyd 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  7. 7

    Reliability of RoHS-Compliant 2D and 3D IC interconnects gan Lau, John H.

    Cyhoeddwyd 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  8. 8

    Advanced MEMS packaging

    Cyhoeddwyd 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Llyfr

    Advanced MEMS packaging
  9. 9

    Advanced MEMS packaging

    Cyhoeddwyd 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  10. 10

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

    Cyhoeddwyd 2003
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

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