Resultats de la cerca - Lau, John H.
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Semiconductor advanced packaging
Publicat 2021Obtenir text complet
Obtenir text complet
Electronic Resource
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Microvias for low-cost, high density interconnects
Publicat 2001Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Reliability of RoHS-Compliant 2D and 3D IC interconnects
Publicat 2011Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Chip scale package (CSP) design, materials, processes, reliability, and applications
Publicat 1999Llibre -
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3D IC integration and packaging
Publicat 2016Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Through-silicon vias for 3D integration
Publicat 2013Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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