Showing 1 - 10 results of 17 for search 'Lau, John H.', सवाल का समय: 0.01सेकंड परिणाम को परिष्कृत करें
  1. 1

    Semiconductor advanced packaging द्वारा Lau, John H.

    प्रकाशित 2021
    पूर्ण पाठ प्राप्त करें
    पूर्ण पाठ प्राप्त करें
    Electronic Resource

    Semiconductor advanced packaging
  2. 2

    Assembly and reliability of lead-free solder joints द्वारा Lau, John H., Lee, Ning-Cheng

    प्रकाशित 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  3. 3

    Heterogeneous integrations द्वारा Lau, John H.

    प्रकाशित 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  4. 4

    Fan-out wafer-level packaging द्वारा Lau, John H.

    प्रकाशित 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  5. 5

    3D IC integration and packaging द्वारा Lau, John H.

    प्रकाशित 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  6. 6

    Through-silicon vias for 3D integration द्वारा Lau, John H.

    प्रकाशित 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  7. 7

    Reliability of RoHS-Compliant 2D and 3D IC interconnects द्वारा Lau, John H.

    प्रकाशित 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  8. 8

    Advanced MEMS packaging

    प्रकाशित 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  9. 9

    Advanced MEMS packaging

    प्रकाशित 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    पुस्तक

    Advanced MEMS packaging
  10. 10

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

    प्रकाशित 2003
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

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