يعرض 1 - 10 نتائج من 17 نتيجة بحث عن 'Lau, John H.', وقت الاستعلام: 0.01s تنقيح النتائج
  1. 1

    Semiconductor advanced packaging حسب Lau, John H.

    منشور في 2021
    احصل على النص الكامل
    احصل على النص الكامل
    Electronic Resource

    Semiconductor advanced packaging
  2. 2

    Assembly and reliability of lead-free solder joints حسب Lau, John H., Lee, Ning-Cheng

    منشور في 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  3. 3

    Heterogeneous integrations حسب Lau, John H.

    منشور في 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  4. 4

    Fan-out wafer-level packaging حسب Lau, John H.

    منشور في 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  5. 5

    3D IC integration and packaging حسب Lau, John H.

    منشور في 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  6. 6

    Through-silicon vias for 3D integration حسب Lau, John H.

    منشور في 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  7. 7

    Reliability of RoHS-Compliant 2D and 3D IC interconnects حسب Lau, John H.

    منشور في 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  8. 8

    Advanced MEMS packaging

    منشور في 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    كتاب

    Advanced MEMS packaging
  9. 9

    Advanced MEMS packaging

    منشور في 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  10. 10

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

    منشور في 2003
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

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