Результаты поиска - Lau, John H.
-
1
-
2
Microvias for low-cost, high density interconnects
Опубликовано 2001Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource
-
3
Reliability of RoHS-Compliant 2D and 3D IC interconnects
Опубликовано 2011Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
4
-
5
-
6
-
7
3D IC integration and packaging
Опубликовано 2016Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
8
Through-silicon vias for 3D integration
Опубликовано 2013Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
9
-
10