Đang hiển thị 1 - 10 kết quả của 18 cho tìm kiếm 'Lau, John', thời gian truy vấn: 0.01s Tinh chỉnh kết quả
  1. 1

    Semiconductor advanced packaging Bằng Lau, John H.

    Được phát hành 2021
    lấy văn bản
    lấy văn bản
    Electronic Resource

    Semiconductor advanced packaging
  2. 2

    Assembly and reliability of lead-free solder joints Bằng Lau, John H., Lee, Ning-Cheng

    Được phát hành 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  3. 3

    Heterogeneous integrations Bằng Lau, John H.

    Được phát hành 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  4. 4

    Fan-out wafer-level packaging Bằng Lau, John H.

    Được phát hành 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  5. 5

    3D IC integration and packaging Bằng Lau, John H.

    Được phát hành 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  6. 6

    Through-silicon vias for 3D integration Bằng Lau, John H.

    Được phát hành 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  7. 7

    Designing accessories Bằng Lau, John

    Được phát hành 2012
    Sách

    Designing accessories
  8. 8

    Reliability of RoHS-Compliant 2D and 3D IC interconnects Bằng Lau, John H.

    Được phát hành 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  9. 9

    Advanced MEMS packaging

    Được phát hành 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Sách

    Advanced MEMS packaging
  10. 10

    Advanced MEMS packaging

    Được phát hành 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging

Công cụ tìm kiếm: