Résultat(s) 1 - 10 résultats de 18 pour la requête 'Lau, John', Temps de recherche: 0,01s Affiner les résultats
  1. 1

    Semiconductor advanced packaging par Lau, John H.

    Publié 2021
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    Electronic Resource

    Semiconductor advanced packaging
  2. 2

    Assembly and reliability of lead-free solder joints par Lau, John H., Lee, Ning-Cheng

    Publié 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  3. 3

    Heterogeneous integrations par Lau, John H.

    Publié 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  4. 4

    Fan-out wafer-level packaging par Lau, John H.

    Publié 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  5. 5

    3D IC integration and packaging par Lau, John H.

    Publié 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  6. 6

    Through-silicon vias for 3D integration par Lau, John H.

    Publié 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  7. 7

    Designing accessories par Lau, John

    Publié 2012
    Livre

    Designing accessories
  8. 8

    Reliability of RoHS-Compliant 2D and 3D IC interconnects par Lau, John H.

    Publié 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  9. 9

    Advanced MEMS packaging

    Publié 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Livre

    Advanced MEMS packaging
  10. 10

    Advanced MEMS packaging

    Publié 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging

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