Showing 1 - 10 results of 18 for search 'Lau, John', Forespørselstid: 0.01s Refine Results
  1. 1

    Semiconductor advanced packaging af Lau, John H.

    Udgivet 2021
    Få fuldtekst
    Få fuldtekst
    Electronic Resource

    Semiconductor advanced packaging
  2. 2

    Assembly and reliability of lead-free solder joints af Lau, John H., Lee, Ning-Cheng

    Udgivet 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  3. 3

    Heterogeneous integrations af Lau, John H.

    Udgivet 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  4. 4

    Fan-out wafer-level packaging af Lau, John H.

    Udgivet 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  5. 5

    3D IC integration and packaging af Lau, John H.

    Udgivet 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  6. 6

    Through-silicon vias for 3D integration af Lau, John H.

    Udgivet 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  7. 7

    Designing accessories af Lau, John

    Udgivet 2012
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    Designing accessories
  8. 8

    Reliability of RoHS-Compliant 2D and 3D IC interconnects af Lau, John H.

    Udgivet 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  9. 9

    Advanced MEMS packaging

    Udgivet 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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    Advanced MEMS packaging
  10. 10

    Advanced MEMS packaging

    Udgivet 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging

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