Résultat(s) 1 - 2 résultats de 2 pour la requête 'Goyal, Deepak', Temps de recherche: 0,01s Affiner les résultats
  1. 1

    3D microelectronic packaging from architectures to applications

    Publié 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Électronique Livre

    3D microelectronic packaging from architectures to applications
  2. 2

    3D microelectronic packaging from fundamentals to applications

    Publié 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Électronique Jeu de données

    3D microelectronic packaging from fundamentals to applications

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