Zobrazuji výsledky 1 - 2 z 2 pro vyhledávání 'Goyal, Deepak', doba hledání: 0,01 s. Upřesnit hledání
  1. 1

    3D microelectronic packaging from architectures to applications

    Vydáno 2021
    Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Available for University of the Philippines System via SpringerLink. Click here to access
    Electronic Resource

    3D microelectronic packaging from architectures to applications
  2. 2

    3D microelectronic packaging from fundamentals to applications

    Vydáno 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    3D microelectronic packaging from fundamentals to applications

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