Search Results - Dimagiba, Richard Raymond
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Investigation of silicon die crack for varying silicon die parameters and die attach materials by Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo
Published in Philippine Engineering Journal [eJournal]Call Number: Loading…Available for University of the Philippines Diliman. Click here
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Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method by Ducusin, Hannah Erika R.
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Investigation of silicon die crack for varying silicon die parameters and die attach material by Macaspac, Hannah Erika
Published in Philippine Engineering Journal (2020)Call Number: Loading…
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