Torthaí cuardaigh - Dimagiba, Richard Raymond

Investigation of silicon die crack for varying silicon die parameters and die attach materials de réir Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

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Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method de réir Ducusin, Hannah Erika R.

Investigation of silicon die crack for varying silicon die parameters and die attach material de réir Macaspac, Hannah Erika