Mostrando 1 - 3 resultados de 3 para a busca 'Dimagiba, Richard Raymond', tempo de busca: 0.01s Refinar Resultados
  1. 1

    Investigation of silicon die crack for varying silicon die parameters and die attach material por Macaspac, Hannah Erika

    Publicado no Philippine Engineering Journal (2020)
    Artigo

    Investigation of silicon die crack for varying silicon die parameters and die attach material
  2. 2

    Investigation of silicon die crack for varying silicon die parameters and die attach materials por Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

    Available for University of the Philippines Diliman. Click here
    Artigo

    Investigation of silicon die crack for varying silicon die parameters and die attach materials
  3. 3

    Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method por Ducusin, Hannah Erika R.

    Tese

    Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method

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