Investigation of silicon die crack for varying silicon die parameters and die attach material 由 Macaspac, Hannah Erika

Investigation of silicon die crack for varying silicon die parameters and die attach materials 由 Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

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Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method 由 Ducusin, Hannah Erika R.