Investigation of silicon die crack for varying silicon die parameters and die attach material by Macaspac, Hannah Erika

Investigation of silicon die crack for varying silicon die parameters and die attach materials by Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

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Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method by Ducusin, Hannah Erika R.