Showing 1 - 3 results of 3 for search 'Dimagiba, Richard Raymond', सवाल का समय: 0.01सेकंड परिणाम को परिष्कृत करें
  1. 1

    Investigation of silicon die crack for varying silicon die parameters and die attach material द्वारा Macaspac, Hannah Erika

    में प्रकाशित Philippine Engineering Journal (2020)
    लेख

    Investigation of silicon die crack for varying silicon die parameters and die attach material
  2. 2

    Investigation of silicon die crack for varying silicon die parameters and die attach materials द्वारा Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

    में प्रकाशित Philippine Engineering Journal [eJournal]
    Available for University of the Philippines Diliman. Click here
    लेख

    Investigation of silicon die crack for varying silicon die parameters and die attach materials
  3. 3

    Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method द्वारा Ducusin, Hannah Erika R.

    थीसिस

    Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method

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