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  1. 1

    Investigation of silicon die crack for varying silicon die parameters and die attach material od Macaspac, Hannah Erika

    Artykuł

    Investigation of silicon die crack for varying silicon die parameters and die attach material
  2. 2

    Investigation of silicon die crack for varying silicon die parameters and die attach materials od Macaspac, Hannah Erika, Callanga, Jennifer, Dimagiba, Richard Raymond, Mena, Manolo

    Available for University of the Philippines Diliman. Click here
    Artykuł

    Investigation of silicon die crack for varying silicon die parameters and die attach materials
  3. 3

    Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method od Ducusin, Hannah Erika R.

    Praca dyplomowa

    Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method

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