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  1. 1

    Elimination of assembly-induces package cracks in plastic SOIC 由 De Guzman, Jose Cesar

    Article

    Elimination of assembly-induces package cracks in plastic SOIC
  2. 2

    Elimination of assembly induced package cracks in plastic SOIC 由 De Guzman, Jose Cesar

    Also available online for University of the Philippines Diliman. Click here
    Article

    Elimination of assembly induced package cracks in plastic SOIC

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