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  1. 1

    Elimination of assembly-induces package cracks in plastic SOIC por De Guzman, Jose Cesar

    Publicado no Philippine Engineering Journal (1997)
    Artigo

    Elimination of assembly-induces package cracks in plastic SOIC
  2. 2

    Elimination of assembly induced package cracks in plastic SOIC por De Guzman, Jose Cesar

    Also available online for University of the Philippines Diliman. Click here
    Artigo

    Elimination of assembly induced package cracks in plastic SOIC

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