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  1. 1

    Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages by Clemente, Richard Q.

    Published in Philippine Engineering Journal (2009)
    Article

    Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages
  2. 2

    Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages by Clemente, Richard Q.

    Also available online for University of the Philippines Diliman. Click here
    Article

    Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

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