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  1. 1

    Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages von Clemente, Richard Q.

    Veröffentlicht in Philippine Engineering Journal (2009)
    Artikel

    Board-level solder joint reliability and finite element modeling of carbon nanotube-filled Leadfree solder alloy on QFN packages
  2. 2

    Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages von Clemente, Richard Q.

    Veröffentlicht in Philippine Engineering Journal
    Also available online for University of the Philippines Diliman. Click here
    Artikel

    Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

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