Toon 1 - 1 resultaten van 1 Voor zoekopdracht 'Cheng, Jie', zoektijd: 0,01s Verfijn jouw resultaten
  1. 1

    Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect door Cheng, Jie

    Gepubliceerd in 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect

Zoekinstrumenten: