Výsledky vyhledávání - Bieler, Thomas R.

Fundamentals of lead-free solder interconnect technology from microstructures to reliability Autor Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

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Advances in hot deformation textures and microstructures proceedings of a symposium sponsored by TMS and ASM International held during Materials Week in Pittsburgh, PA, October 18-...