Search Results - Bieler, Thomas R.
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Fundamentals of lead-free solder interconnect technology from microstructures to reliability by Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao
Published 2015Call Number: Loading…Available for University of the Philippines System via SpringerLink. Click here to access
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Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
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Advances in hot deformation textures and microstructures proceedings of a symposium sponsored by TMS and ASM International held during Materials Week in Pittsburgh, PA, October 18-...
Published 1994Call Number: Loading…
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